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TC1262
500mA Fixed Output CMOS LDO
Features
* * * * * Very Low Dropout Voltage 500mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection
Package Type
3-Pin TO-220
Tab is GND
3-Pin DDPAK
Front View Tab is GND
TC1262
1 2 3
TC1262
1 2 3
Applications
* * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers
VOUT
GND
Front View
3 Tab is GND
VOUT
2
GND
Device Selection Table
Part Number TC1262-xxVDB TC1262-xxVAB TC1262-xxVEB Package 3-Pin SOT-223 3-Pin TO-220 3-Pin DDPAK Junction Temp. Range -40C to +125C -40C to +125C -40C to +125C
TC1262
1
VIN
General Description
The TC1262 is a fixed output, high accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1262's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80A at full load (20 to 60 times lower than in bipolar regulators). TC1262 key features include ultra low noise operation, very low dropout voltage (typically 350mV at full load), and fast response to step changes in load. The TC1262 incorporates both over temperature and over current protection. The TC1262 is stable with an output capacitor of only 1F and has a maximum output current of 500mA. It is available in 3-Pin SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
NOTE: xx indicates output voltages. Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages are available. Please contact Microchip Technology Inc. for details.
Typical Application
VIN VIN VOUT + C1 1F VOUT
TC1262
GND
2002 Microchip Technology Inc.
DS21373B-page 1
VOUT
VIN
GND
VIN
3-Pin SOT-223
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TC1262
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V Output Voltage.................. (VSS - 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature.......................... -65C to +150C
TC1262 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage Min 2.7 500 Typ -- -- Max 6.0 -- -- VR + 2.5% -- 0.35 0.01 30 130 390 650 130 -- -- -- -- Units V mA V ppm/C %/V %/mA mV Note 1 Note 2 (VR + 1V) VIN 6V IL = 0.1mA to IOUTMAX (Note 3) IL = 100A IL = 100mA IL = 300mA IL = 500mA (Note 4) IL = 0 FRE 1kHz VOUT = 0V Note 5 IL = IOUTMAX, FRE = 10kHz Note 7 Test Conditions
-- VR 0.5% VR - 2.5% -- -- -- -- -- -- -- -- -- -- -- -- 40 .003 0.002 20 60 200 350 80 64 1200 0.04 260
IDD PSRR IOUTSC VOUT/PD eN
Note 1: 2: 3:
Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
A dB mA V/W nV/Hz
4: 5: 6:
7:
VR is the regulator output voltage setting. TC VOUT = (VOUTMAX - VOUTMIN) x 10 6 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX.
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DS21373B-page 2
2002 Microchip Technology Inc.
TC1262
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (3-Pin SOT-223) (3-Pin TO-220) (3-Pin DDPAK) 1 2 3
PIN FUNCTION TABLE
Symbol
Description
VIN GND VOUT
Unregulated supply input. Ground terminal. Regulated voltage output.
3.0
DETAILED DESCRIPTION
3.1
Output Capacitor
The TC1262 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1262's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
+ VIN C1 1F VOUT + VOUT C2 1F
+ Battery -
TC1262
GND
A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5, and a resonant frequency above 1MHz. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
2002 Microchip Technology Inc.
DS21373B-page 3
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TC1262
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
TABLE 4-2:
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
THERMAL RESISTANCE GUIDELINES FOR TC1262 IN 3-PIN DDPAK/TO-220 PACKAGE
Copper Area (Backside) Board Area Thermal Resistance (JA) 25C/W 27C/W 35C/W
Copper Area (Topside)*
4.2
Power Dissipation
2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 125 sq mm 2500 sq mm 2500 sq mm
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
*Tab of device attached to topside copper Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V 10% VOUTMIN = 2.7V 0.5% ILOADMAX = 275mA TJMAX TAMAX JA = 125C = 95C = 59C/W (SOT-223)
EQUATION 4-1:
PD (VINMAX - VOUTMIN)ILOADMAX Where: PD = VINMAX = VOUTMIN = ILOADMAX = Worst case actual power dissipation Maximum voltage on VIN Minimum regulator output voltage Maximum output (load) current
The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA).
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(3.3 x 1.1) - (2.7 x .995)]275 x 10-3 = 260mW Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX) JA = (125 - 95) 59 = 508mW In this example, the TC1262 dissipates a maximum of 260mW; below the allowable limit of 508mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by sustituting the maximum allowable power dissipation of 508mW into Equation 4-1, from which VINMAX = 4.6V.
EQUATION 4-2:
PDMAX = (TJMAX - TAMAX) JA Where all terms are previously defined. Table 4-1 and Table 4-2 show various values of JA for the TC1262 packages.
TABLE 4-1:
THERMAL RESISTANCE GUIDELINES FOR TC1262 IN SOT-223 PACKAGE
Copper Area (Backside) Board Area Thermal Resistance (JA) 45C/W 45C/W 53C/W 59C/W 52C/W 55C/W
Copper Area (Topside)*
2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 225 sq mm 100 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 0 sq mm 1000 sq mm
1000 sq mm 1000 sq mm 1000 sq mm
*Tab of device attached to topside copper
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DS21373B-page 4
2002 Microchip Technology Inc.
TC1262
5.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation vs. Temperature
0.020 0.018 LINE REGULATION (%) 0.016 NOISE (V/Hz) 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40C 0.0 0C 25C 70C 85C 125C 1.0 10.0
Output Noise vs. Frequency
RLOAD = 50 COUT = 1F
Load Regulation vs. Temperature
0.0100 0.0090 LOAD REGULATION (%/mA) 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 -40C 0C 25C 70C 85C 125C 5V 2.5V 1mA to 500mA
0.1
1mA to 500mA
0.01
0.01
1
10
100
1000
TEMPERATURE (C)
FREQUENCY (kHz)
TEMPERATURE (C)
IDD vs. Temperature
150 135
2.5V Dropout Voltage vs. ILOAD
0.50 125C 0.50 85C 70C 0.30 25C 0.40 85C 0.30 70C 25C 0.20 125C
LOAD
DROPOUT VOLTAGE (V)
105
90 75 60 45 30 15 0 -40C
2.5V 5V
0.20 -40C 0.10
0C
DROPOUT VOLTAGE (V)
120
0.40
IDD (A)
0C 0.10 -40C
0.00 0C 25C 70C 85C 125C 0 100 TEMPERATURE (C) 200 300 400 ILOAD (mA) 500
0.00 0 100 200 300 400 ILOAD (mA) 500
2.5V VOUT vs. Temperature
2.70 2.50 2.30 VOUT (V) VOUT (V) 2.10 1.90 1.70 1.50 -40C IL = 300mA A IL = 500mA A IL = 0.1mA 5.20 5.10 5.00 4.90 4.80 4.70 4.60 4.50 4.40 4.30
5.0V VOUT vs. Temperature
IL = 0.1mA
IL IL
0C
25C
70C
85C
125C
4.20 4.10 4.00 -40C
0C
25C
70C
85C
125C
TEMPERATURE (C)
TEMPERATURE (C)
2002 Microchip Technology Inc.
DS21373B-page 5
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TC1262
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device Marking
W
PIN 1
P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
Component Taping Orientation for 3-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device Marking
W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin DDPAK
24 mm
16 mm
750
13 in
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DS21373B-page 6
2002 Microchip Technology Inc.
TC1262
6.3 Package Dimensions
3-Pin SOT-223
.264 (6.70) .248 (6.30)
.122 (3.10) .114 (2.90)
.287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30)
PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP.
.041 (1.04) .033 (0.84)
10 MAX. .036 (0.91) MIN.
.013 (0.33) .009 (0.24)
Dimensions: inches (mm)
3-Pin TO-220
.185 (4.70) .165 (4.19) .113 (2.87) .103 (2.62) .410 (10.41) .357 (9.06) .156 (3.96) .146 (3.71) DIA.
.055 (1.40) .045 (1.14)
.258 (6.55) .230 (5.84) .594 (15.09) .569 (14.45) 3 - 7.5 5 PLCS.
.244 (6.20) .234 (5.94) .560 (14.22) .518 (13.16) .055 (1.40) .045 (1.14) .037 (0.94) .027 (0.69) PIN 1 .105 (2.67) .095 (2.41) .205 (5.21) .195 (4.95) Dimensions: inches (mm)
.020 (0.51) .012 (0.30)
.115 (2.92) .095 (2.41)
2002 Microchip Technology Inc.
DS21373B-page 7
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TC1262
6.3 Package Dimensions (Continued)
3-Pin DDPAK
.410 (10.41) .385 (9.78) .067 (1.70) .045 (1.14) 3 - 7 (5x) .010 (0.25) .000 (0.00) .051 (1.30) .049 (1.24) .037 (0.94) .026 (0.66) .100 (2.54) TYP. 8 MAX. Dimensions: inches (mm) .026 (0.66) .014 (0.36) .110 (2.79) .068 (1.72) .183 (4.65) .170 (4.32)
.055 (1.40) .045 (1.14)
.370 (9.40) .330 (8.38) .605 (15.37) .549 (13.95)
PIN 1
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DS21373B-page 8
2002 Microchip Technology Inc.
TC1262
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21373B-page 9
TC1262
NOTES:
DS21373B-page 10
2002 Microchip Technology Inc.
TC1262
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21373B-page 11
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WORLDWIDE SALES AND SERVICE
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05/01/02
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DS21373B-page 12
2002 Microchip Technology Inc.
*B37312SD*

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